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TFDU6301
Vishay Semiconductors
Fast Infrared Transceiver Module (FIR, 4 Mbit/s) for 2.4 V to 3.6 V Operation and Low-Voltage Logic (1.8 V)
Description
The TFDU6301 transceiver is an infrared transceiver module compliant to the latest IrDA physical layer low-power standard for fast infrared data communication, supporting IrDA speeds up to 4 Mbit/s (FIR), HPSIR(R), Sharp ASK(R) and carrier based remote control modes up to 2 MHz. Integrated within the transceiver module is a photo PIN diode, an infrared emitter (IRED), and a low-power control IC to provide a total front-end solution in a single package. This new Vishay FIR transceiver is built in a new smaller package using the experiences of the lead frame BabyFace technology. The transceivers are capable of directly interfacing with a wide variety of I/O devices, which perform the modulation/ demodulation function. At a minimum, a Vcc bypass capacitor is the
only external component required implementing a complete solution. TFDU6300 has a tri-state output and is floating in shutdown mode with a weak pull-up. An otherwise identical transceiver with supply voltage related logic levels is available as TFDU6300.
Features
* Compliant to the latest IrDA physical layer specification (Up to 4 Mbit/s), HP-SIR(R), Sharp ASK(R) and TV Remote e3 Control * Operates from 2.4 V to 3.6 V within specification * Low power consumption (1.8 mA typ. supply current) * Power shutdown mode (0.1 A typ. shutdown current) * Surface mount package - Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm) * Tri-state-receiver output, floating in shut down with a weak pull-up * High efficiency emitter * Low profile (universal) package capable of surface mount soldering to side and top view orientation * Directly interfaces with various Super I/O and controller devices * Only one external component required * Backward pin to pin compatible to all Vishay SIR and FIR Infrared Transceivers * Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs * Internal logic voltage reference of 1.8 V * Lead (Pb)-free device * Device in accordance to RoHS 2002/95/EC and WEEE 2002/96EC
Applications
* Notebook computers, desktop PCs, Palmtop computers (Win CE, Palm PC), PDAs * Digital cameras and video cameras * Printers, fax machines, photocopiers, screen projectors * Telecommunication products (cellular phones, pagers) * Internet TV boxes, video conferencing systems * External infrared adapters (dongles) * Medical an industrial data collection
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Parts Table
Part TFDU6301-TR3 TFDU6301-TT3 Description Oriented in carrier tape for side view surface mounting Oriented in carrier tape for side view surface mounting 2500 pcs 2500 pcs Qty / Reel or Tube
Functional Block Diagram
VCC1 Tri-State Driver Amplifier Comparator VCC2 SD RXD
Logic &
Control TXD
18468_1
Controlled Driver
GND
Figure 1. Functional Block Diagram
Pin Description
Pin Number 1 Function Description I/O Active IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages VCC2 IRED Anode than 3.6 V an external resistor might be necessary for reducing the internal power dissipation. This pin is allowed to be supplied from an uncontrolled power supply separated from the controlled Vcc1 - supply. IRED Cathode TXD IRED cathode, internally connected to driver transistor This input is used to transmit serial data when SD is low. An on-chip protection circuit disables the IRED driver if the TXD pin is asserted for longer than 100 s. When used in conjunction with the SD pin, this pin is also used to control the receiver mode. Logic reference: 1.8 V logic Received data output, push-pull CMOS driver output capable of driving standard CMOS. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 kOhm (typ.) in shutdown mode. High/ Low levels adapted to 1.8 V logic. RXD echoes the TXD signal. Shutdown, also used for dynamic mode switching. Setting this pin active places the module into shutdown mode. On the falling edge of this signal, the state of the TXD pin is sampled and used to set receiver low bandwidth (TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode. Supply voltage Internally not connected. Ground I I HIGH
2 3
4
RXD
O
LOW
5
SD
I
HIGH
6 7 8
VCC1 NC GND
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors
TFDU6301 weight 0.075 g
19531
Figure 2. Pinning
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage range, transceiver Supply voltage range, transmitter Voltage at all I/O pins Input currents Output sinking current Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature Average output current Repetitive pulse output current ESD protection Virtual source size Maximum Intensity for Class 1 < 90 s, ton < 20 % Human body model Method: (1-1/e) encircled energy IEC60825-1 or EN60825-1, edition Jan. 2001 d Ie See chapter "Recommended Solder Profiles" IIRED (DC) IIRED (RP) 1 1.8 2.0
*)
Test Conditions 0 V < VCC2 < 6 V 0 V < VCC1 < 6 V Vin < VCC1 is allowed For all pins, except IRED anode pin
Symbol VCC1 VCC2
Min - 0.5 - 0.5 - 0.5
Typ.
Max 6 6.5 6 10 25
Unit V V V mA mA mW C C C C mA mA kV mm mW/sr
PD TJ Tamb Tstg - 25 - 25
500 125 + 85 + 85 260 150 700
(500)**)
*) Due to the internal limitation measures and the IrDA defined transmission protocol the device is a "class 1" device when operated inside the absolute maximum ratings **) IrDA specifies the maximum intensity with 500 mW/sr
Definitions: In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhy
1.4. A new version of the standard in any case obsoletes the former version. With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4 (in Oct. 2002).
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Electrical Characteristics Transceiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Supply voltage Dynamic Supply current Test Conditions Symbol VCC Min 2.4 Typ. Max 3.6 Unit V
Receive mode only, idle In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending on RXD load. SIR mode MIR/FIR mode ICC ICC ISD 1.8 2.0 0.01 3.0 3.3 mA mA A
Shutdown supply current
SD = High T= 25 C, not ambient light sensitive, detector is disabled in shutdown mode SD = High, full specified temperature range, not ambient light sensitive Internally generated
Shutdown supply current
ISD
1
A
Operating temperature range Digital Reference Voltage Input voltage low (TXD, SD) Input voltage high*) (TXD, SD) Input leakage current (TXD, SD) Input capacitance, TXD, SD Output voltage low Output voltage high Output RXD current limitation high state low state SD shutdown pulse duration RXD to VCC1 impedance SD mode programming pulse duration
*)
TA Vdd VIL VIH Vin > 1.6 V IICH CI IOL = 500 A Cload = 15 pF IOH = - 250 A Cload = 15 pF Short to Ground Short to VCC1 Activating shutdown RRXD All modes tSDPW VOL VOH
- 25 1.62 - 0.5 1.5 -1 1.8 1.8
+ 85 1.98 0.5 6 +1 5 0.4
C V V V A pF V V
0.8 x Vdd
20 20 30 400 200 500 600
mA mA s k ns
The typical threshold level is 0.5 x Vdd. It is recommended to use the specified min/max values to avoid increased operating current.
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors Optoelectronic Characteristics Receiver
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Minimum irradiance Ee*) in angular range **) Minimum irradiance Ee in angular range, MIR mode Minimum irradiance Ee inangular range, FIR mode Maximum irradiance Ee in angular range ***) Rise time of output signal Fall time of output signal RXD pulse width of output signal, 50 %, SIR mode RXD pulse width of output signal, 50 %, MIR mode RXD pulse width of output signal, 50 %, FIR mode RXD pulse width of output signal, 50 %, FIR mode Stochastic jitter, leading edge Test Conditions 9.6 kbit/s to 115.2 kbit/s = 850 nm to 900 nm, VCC = 2.4 V 1.152 Mbit/s = 850 nm to 900 nm, VCC = 2.4 V 4 Mbit/s = 850 nm to 900 nm, VCC = 2.4 V = 850 nm to 900 nm 10 % to 90 %, CL = 15 pF 90 % to 10 %, CL = 15 pF Input pulse length 1.4 s < PWopt < 25 s Input pulse length PWopt = 217 ns, 1.152 Mbit/s Input pulse length PWopt = 125 ns, 4 Mbit/s Input pulse length PWopt = 250 ns, 4 Mbit/s Input irradiance = 100 mW/m2, 4.0 Mbit/s 1.152 Mbit/s 115.2 kbit/s After completion of shutdown programmimg sequence Power on dalay tL 40 Symbol Ee Min Typ. 50 (5) 100 (10) 130 (13) 5 (500) 10 10 1.6 105 2.2 250 40 40 3 275 200 (20) Max 80 (8) Unit mW/m2 (W/cm2) mW/m2 (W/cm2) mW/m2 (W/cm2) kW/m2 (mW/cm2) ns ns s ns
Ee
Ee
Ee tr (RXD) tf (RXD) tPW tPW
tPW
105
125
145
ns
tPW
225
250
275
ns
25 80 350 250
ns ns ns s
Receiver start up time
Latency
100
s
Note: All timing data measured with 4 Mbit/s are measured using the IrDA(R) FIR transmission header. The data given here are valid 5 s after starting the preamble.
*)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
**) IrDA sensitivity definition (equivalent to threshold irradiance): Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length. ***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. For more definitions see the document "Symbols and Terminology" on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Transmitter
Tamb = 25 C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter IRED operating current, switched current limiter Output leakage IRED current Output radiant intensity, s. figure VCC = VIRED = 3.3 V, = 0 3, recommended appl. circuit TXD = High, SD = Low, R1 = 1 Output radiant intensity, s. figure VCC = VIRED = 3.3 V, = 0 , 15 3, recommended appl. circuit TXD = High, SD = Low, R1 = 1 Output radiant intensity VCC1 = 3.3 V, = 0 , 15 TXD = Low or SD = High (Receiver is inactive as long as SD = High) Test Conditions Note: No external resistor current limiting resistor is needed Symbol ID Min 330 Typ. 440 Max 600 Unit mA
IIRED Ie Ie
-1 65 50 180 125
1 500*) 500*)
A mW/sr mW/sr
Ie
0.04
mW/sr
Output radiant intensity, Angle of Half Intensity Peak - emission wavelength**) Spectral bandwidth Optical rise time, Optical fall time Optical output pulse duration Optical output pulse duration Optical output pulse duration Optical output pulse duration Optical overshoot *) Maximum value is given by the IrDA-Standard Input pulse width 217 ns, 1.152 Mbit/s Input pulse width 125 ns, 4 Mbit/s Input pulse width 250 ns, 4 Mbit/s input pulse width t < 100 s input pulse width t 100 s
p tropt, tfopt topt topt topt topt topt 10 207 117 242 875
24 886 45 40 217 125 250 t 20 100 25 227 133 258 900
nm nm ns ns ns ns s s %
**) Note: Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the standard Remote Control applications with codes as e.g. Philips RC5/RC6(R) or RECS 80. When operated under IrDA full range conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers are used
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors Recommended Circuit Diagram
Operated at a clean low impedance power supply the TFDU6300 needs no additional external components. However, depending on the entire system design and board layout, additional components may be required (see figure 3). a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2, C1 and C2 are optional and dependent on the quality of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to the transceiver power supply pins. A Tantalum capacitor should be used for C1 while a ceramic capacitor is used for C2. In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current rise time. In that case another 4.7 F (type, see table under C1) at VCC2 will be helpful. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
V cc2 V cc1 GND SD TXD RXD C1
R1 R2 C2
IRED Anode V cc Ground SD TXD RXD IRED Cathode
19307
Figure 3. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and eliminates the inductance of the power supply line. This one should be a Tantalum or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is only necessary for high operating voltages and elevated temperatures. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs
Table 1. Recommended Application Circuit Components
Component C1 C2 R1 R2 Recommended Value 4.7 F, 16 V 0.1 F, Ceramic no resistor necessary, the internal controller is able to control the current 10 , 0.125 W CRCW-1206-10R0-F-RT1 Vishay Part Number 293D 475X9 016B VJ 1206 Y 104 J XXMT
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application. TXD is now enabled as normal TXD input for the high bandwidth mode.
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "HIGH". 2. Set TXD input to logic "LOW". Wait ts 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TXD, which determines speed setting). 4. TXD must be held for th 200 ns. TXD is now enabled as normal TXD input for the lower bandwidth mode.
Mode Switching
The TFDU6300 is in the SIR mode after power on as a default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described below are required.
SD
50 %
ts TXD 50 %
th High : FIR 50 % Low : SIR
Setting to the High Bandwidth Mode (0.576 Mbit/s to 4 Mbit/s)
1. Set SD input to logic "HIGH". 2. Set TXD input to logic "HIGH". Wait ts 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TXD, which determines speed setting). 4. After waiting th 200 ns TXD can be set to logic "LOW". The hold time of TXD is limited by the maximum allowed pulse length.
14873
Figure 4. Mode Switching Timing Diagram
Table 2. Truth table
Inputs SD high low low low low low TXD x high high > 100 s low low low Optical input Irradiance mW/m2 x x x <4 > Min. detection threshold irradiance < Max. detection threshold irradiance > Max. detection threshold irradiance RXD weakly pulled (500 k) to VCC1 high high high low (active) x Outputs Transmitter 0 Ie 0 0 0 0
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors
Recommended Solder Profiles for TFDU6301
Solder Profile for Sn/Pb soldering
275 10 s max. at 230 C 240 C max. 2...4 C/s Temperature/C 160 C max. 120 s...180 s 250 225 200 175 150 125 100 75 50 25 0 50 100 150 Time/s
19532
260 240 220 200 180 160 140 120 100 80 60 40 20 0
19535
T 255 C for 10 s....30 s T 217 C for 70 s max
Tpeak = 260 C
Temperature (C)
30 s max. 90 s...120 s 70 s max. 2 C...4 C/s 2 C...3 C/s
90 s max.
2...4 C/s
200
250
300
350
0 0 50 100 150 200 Time/s 250 300 350
Figure 5. Recommended Solder Profile for Sn/Pb soldering
Figure 6. Solder Profile, RSS Recommendation
Lead (Pb)-Free, Recommended Solder Profile The TFDU6301 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-SoakSpike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-To-Spike profile is used increasingly. Shown below in figure 6 and 7 are VISHAY's recommended profiles for use with the TFDU6300 transceivers. For more details please refer to Application note: SMD Assembly Instruction. A ramp-up rate less than 0.9 C/s is not recommended. Ramp-up rates faster than 1.3 C/s could damage an optical part because the thermal conductivity is less than compared to a standard IC.
280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 50
Tpeak = 260 C max
Temperature/C
< 4 C/s 1.3 C/s
Time above 217 C t 70 s Time above 250 C t 40 s Peak temperature Tpeak = 260 C
< 2 C/s
100
150 Time/s
200
250
300
Figure 7. RTS Recommendation
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Package Dimensions in mm
TFDU6301 (Universal) Package
19533
Figure 8. Package Drawing
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors Tape and Reel Information
14017
Figure 9. Reel drawing
Tape Width mm 16 16
A max. mm 180 330
N mm 60 50
W1 min. mm 16.4 16.4
W2 max. mm 22.4 22.4
W3 min. mm 15.9 15.9
W3 max. mm 19.4 19.4
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Tape Dimensions in mm
Drawing-No.: 9.700-5280.01-4 Issue: 1; 03.11.03 Figure 10. Tape drawing, TFDU6301 for top view mounting
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Document Number 84668 Rev. 1.0, 06-Apr-06
TFDU6301
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4 Issue: 1; 08.12.04 Figure 11. Tape drawing, TFDU6301 for side view mounting
Document Number 84668 Rev. 1.0, 06-Apr-06
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TFDU6301
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 84668 Rev. 1.0, 06-Apr-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 Revision: 08-Apr-05
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